Ultrasonic welding contract processing service
Stable ultrasonic bonding technology using rigid clamps applicable to a wide range of applications.
Our company manufactures and sells "ultrasonic welding equipment" and also provides contract processing services. With our rigid clamp technology that holds the horn with high rigidity, we achieve stable ultrasonic welding across a wide range of applications, from low to high loads. Ultrasonic welding can be applied in various fields such as next-generation secondary batteries, semiconductor packaging, heat sink formation, and flexible substrate bonding. We offer a lineup of equipment ranging from standalone models to those for mass production. 【Application Examples】 - Next-generation secondary batteries (Li foil bonding, Li-copper foil bonding) - Semiconductor packaging - Heat sink formation (pin fin/ribbon fin) - Flexible substrate bonding - IGBT modules (terminal bonding) - Wire harness and electrical wire bonding - DMB (Dot Matrix Bonding) bonding *For more details, please refer to the PDF document or feel free to contact us.
- Company：アドウェルズ
- Price：Other
